- Published: November 2023
- Pages: 252
- Tables: 53
- Figures: 44
- Series: Electronics
The speed of development of generative AI, boosted by the success of OpenAI's ChatGPT, is raising investor interest in companies working on AI-related infrastructure such as AI chips. Artificial Intelligence (AI) chips are a new generation of microprocessors chips designed to efficiently run AI-related workloads like machine learning, neural networks, and deep learning. As AI technology has advanced rapidly in recent years, there has been increasing demand for hardware optimized for AI processing versus general-purpose computer chips. AI chips are designed to run such AI algorithms faster and more efficiently than traditional processors. This has driven extensive research, development, and investment into AI chip technology by established and emerging companies.
The Global Market for AI Chips 2024-2034 provides a comprehensive analysis of the global AI chip landscape. Spanning over 300 pages, the report covers AI chip technology fundamentals, key capabilities enabled, applications across industries, market segmentation, regional trends, major players, start-up ecosystem, funding and investments, challenges, manufacturing and supply chain dynamics, architectural innovations, sustainability impacts, and the future outlook for these transformative technologies.
Multiple data tables and charts quantify market size projections to 2034 by region, vertical, chip type, and more. Profiles of over 100 companies highlight competitive positioning. Expert insights identify growth opportunities as specialized AI hardware progresses. The Global Market for AI Chips 2024-2034 is ideal for semiconductor industry participants, tech investors, and companies strategizing AI chip adoption to inform planning amid this rapidly evolving space.
Report contents include:
- AI Chip Technology Fundamentals
- Architectures like GPUs, ASICs, neuromorphic chips
- Processing capabilities enabled by AI hardware
- Development history and ecosystem
- Market Landscape and Segmentation
- Market size forecasts globally and by region
- Breakdown by chip type - ASICs, GPUs, CPUs, FPGAs
- Split by training vs inference workloads
- Segmentation by end-use industry vertical
- Regional Analysis
- AI chip development trends in China
- Government policies in the US, Europe, South Korea, Japan
- Edge AI advances by country
- Industry Drivers and Adoption Factors
- Key market growth drivers
- Government funding and R&D initiatives
- Corporate investments fuelling innovation
- Applications propelling demand across domains
- Competitive Environment
- Profiles of over 130 leading companies. Companies profiled include AMD, Astrus, Celestial AI, Cerebras, d-Matrix, DEEPX, EdgeCortix® Inc., Etched.ai, Enfabrica, Enflame, Google, Horizon Robotics, IBM, Kneron, Lightmatter, Modular, MediaTek Inc, Mythic, Neuchips, Nvidia, Panmnesia, Rebellions, Samsung, SambaNova Systems, Sapeon, SiMa.ai, SpiNNcloud Systems GmbH and Tenstorrent.
- Start-ups advancing new architectures
- Silicon giants leveraging semiconductor expertise
- Cloud providers and automotive supplier activity
- Technology Innovations
- Novel materials, packaging, software abstractions
- Architectural advances in processing, memory, interconnects
- Progress in manufacturing techniques like lithography, 3D stacking
- Challenges and Sustainability
- Design, benchmarking, programming complexities
- Geopolitical implications and policy considerations
- Environmental stewardship priorities and frameworks
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1 RESEARCH METHODOLOGY 15
2 INTRODUCTION 16
- 2.1 What is an AI chip? 16
- 2.1.1 AI Acceleration 17
- 2.1.2 Hardware & Software Co-Design 17
- 2.2 Key capabilities 18
- 2.3 History of AI Chip Development 19
- 2.4 Applications 20
- 2.5 AI Chip Architectures 21
- 2.6 Computing requirements 23
- 2.7 Semiconductor packaging 24
- 2.7.1 Evolution from 1D to 3D semiconductor packaging 24
- 2.8 AI chip market landscape 25
- 2.8.1 China 26
- 2.8.2 USA 28
- 2.8.2.1 The US CHIPS and Science Act of 2022 28
- 2.8.3 Europe 29
- 2.8.3.1 The European Chips Act of 2022 29
- 2.8.4 Rest of Asia 30
- 2.8.4.1 South Korea 30
- 2.8.4.2 Japan 30
- 2.8.4.3 Taiwan 31
- 2.9 Edge AI 31
- 2.9.1 Edge vs Cloud 32
- 2.9.2 Edge devices that utilize AI chips 33
- 2.9.3 Players in edge AI chips 34
- 2.9.4 Inference at the edge 35
- 2.10 Market drivers 36
- 2.11 Government funding and initiatives 37
- 2.12 Funding and investments 38
- 2.13 Market challenges 41
- 2.14 Market players 43
- 2.15 Future Outlook for AI Chips 44
- 2.15.1 Specialization 44
- 2.15.2 3D System Integration 45
- 2.15.3 Software Abstraction Layers 45
- 2.15.4 Edge-Cloud Convergence 45
- 2.15.5 Environmental Sustainability 45
- 2.15.6 Neuromorphic Photonics 45
- 2.15.7 New Materials 46
- 2.15.8 Efficiency Improvements 47
- 2.15.9 Automated Chip Generation 48
- 2.16 AI roadmap 49
3 AI CHIP FABRICATION 50
- 3.1 Supply chain 50
- 3.2 Fab investments and capabilities 51
- 3.3 Manufacturing advances 53
- 3.3.1 Chiplets 53
- 3.3.2 3D Fabrication 53
- 3.3.3 Algorithm-Hardware Co-Design 54
- 3.3.4 Advanced Lithography 54
- 3.3.5 Novel Devices 55
4 AI CHIP ARCHITECTURES 56
- 4.1 Distributed Parallel Processing 56
- 4.2 Optimized Data Flow 56
- 4.3 Flexible vs. Specialized Designs 57
- 4.4 Hardware for Training vs. Inference 58
- 4.5 Software Programmability 58
- 4.6 Architectural Optimization Goals 59
- 4.7 Innovations 60
- 4.7.1 Specialized Processing Units 60
- 4.7.2 Dataflow Optimization 61
- 4.7.3 Model Compression 61
- 4.7.4 Biologically-Inspired Designs 62
- 4.7.5 Analog Computing 63
- 4.7.6 Photonic Connectivity 63
- 4.8 Sustainability 64
- 4.8.1 Energy Efficiency 64
- 4.8.2 Green Data Centers 64
- 4.8.3 Eco-Electronics 65
- 4.8.4 Reusable Architectures & IP 65
- 4.8.5 Regulated Lifecycles 65
- 4.8.6 AI for Sustainability 66
- 4.8.7 AI Model Efficiency 66
- 4.9 Companies, by architecture 67
5 TYPES OF AI CHIPS 68
- 5.1 Training Accelerators 68
- 5.2 Inference Accelerators 70
- 5.3 Automotive AI Chips 72
- 5.4 Smart Device AI Chips 74
- 5.5 Cloud Data Center Chips 76
- 5.6 Edge AI Chips 78
- 5.7 Neuromorphic Chips 79
- 5.8 FPGA-Based Solutions 80
- 5.9 Multi-Chip Modules 81
- 5.10 Emerging technologies 83
- 5.10.1 Novel Materials 83
- 5.10.1.1 2D materials 83
- 5.10.1.2 Photonic materials 84
- 5.10.1.3 Spintronic materials 84
- 5.10.1.4 Phase change materials 85
- 5.10.1.5 Neuromorphic materials 86
- 5.10.2 Advanced Packaging 86
- 5.10.3 Software Abstraction 87
- 5.10.4 Environmental Sustainability 87
- 5.10.1 Novel Materials 83
- 5.11 Specialized components 88
- 5.11.1 Sensor Interfacing 88
- 5.11.2 Memory Technologies 89
- 5.11.2.1 HBM stacks 89
- 5.11.2.2 GDDR 89
- 5.11.2.3 SRAM 90
- 5.11.2.4 STT-RAM 90
- 5.11.2.5 ReRAM 90
- 5.11.3 Software Frameworks 90
- 5.11.4 Data Center Design 91
6 AI CHIP MARKETS 93
- 6.1 Market map 93
- 6.2 Data Centers 95
- 6.2.1 Market overview 95
- 6.2.2 Market players 95
- 6.2.3 Hardware 96
- 6.2.4 Trends 96
- 6.3 Automotive 98
- 6.3.1 Market overview 98
- 6.3.2 Market outlook 98
- 6.3.3 Autonomous Driving 99
- 6.3.3.1 Market players 99
- 6.3.4 Increasing power demands 100
- 6.3.5 Market players 101
- 6.4 Industry 4.0 102
- 6.4.1 Market overview 102
- 6.4.2 Applications 102
- 6.4.3 Market players 103
- 6.5 Smartphones 104
- 6.5.1 Market overview 104
- 6.5.2 Commercial examples 106
- 6.5.3 Smartphone chipset market 107
- 6.5.4 Process nodes 107
- 6.6 Tablets 109
- 6.6.1 Market overview 109
- 6.6.2 Market players 109
- 6.7 IoT & IIoT 111
- 6.7.1 Market overview 111
- 6.7.2 AI on the IoT edge 111
- 6.7.3 Consumer smart appliances 112
- 6.7.4 Market players 113
- 6.8 Computing 114
- 6.8.1 Market overview 114
- 6.8.2 Personal computers 114
- 6.8.3 Parallel computing 115
- 6.8.4 Low-precision computing 115
- 6.8.5 Market players 116
- 6.9 Drones & Robotics 117
- 6.9.1 Market overview 117
- 6.9.2 Market players 118
- 6.10 Wearables, AR glasses and hearables 119
- 6.10.1 Market overview 119
- 6.10.2 Applications 119
- 6.10.3 Market players 120
- 6.11 Sensors 122
- 6.11.1 Market overview 122
- 6.11.2 Challenges 122
- 6.11.3 Applications 123
- 6.11.4 Market players 123
- 6.12 Life Sciences 125
- 6.12.1 Market overview 125
- 6.12.2 Applications 125
- 6.12.3 Market players 126
7 GLOBAL MARKET REVENUES AND COSTS 127
- 7.1 Costs 127
- 7.2 Revenues by chip type, 2020-2034 128
- 7.3 Revenues by market, 2020-2034 130
- 7.4 Revenues by region, 2020-2034 132
8 COMPANY PROFILES 134 (133 company profiles)
9 REFERENCES 249
List of Tables
- Table 1. Markets and applications for AI chips. 21
- Table 2. AI Chip Architectures. 22
- Table 3. Computing requirements and constraints. 23
- Table 4. Computing requirements and constraints by applications. 23
- Table 5. Advantages and disadvantages of edge AI. 31
- Table 6. Edge vs Cloud. 32
- Table 7. Edge devices that utilize AI chips. 33
- Table 8. Players in edge AI chips. 35
- Table 9. Market drivers for AI Chips. 36
- Table 10. AI chip government funding and initiatives. 37
- Table 11. AI chips funding and investment, by company. 38
- Table 12. Market challenges in AI chips. 42
- Table 13. Key players in AI chips. 43
- Table 14. AI Chip Supply Chain. 50
- Table 15. Fab investments and capabilities. 52
- Table 16. Comparison of AI chip fabrication capabilities between IDMs (integrated device manufacturers) and dedicated foundries. 52
- Table 17. Goals driving the exploration into AI chip architectures. 59
- Table 18. Concepts from neuroscience influence architecture. 62
- Table 19. Companies by Architecture. 67
- Table 20. Types of training accelerators for AI chips. 70
- Table 21. Types of inference accelerators for AI chips. 72
- Table 22. Types of Automotive AI chips. 74
- Table 23. Smart device AI chips. 76
- Table 24. Types of cloud data center AI chips. 77
- Table 25. Key types of edge AI chips. 78
- Table 26. Types of neuromorphic chips and their attributes. 80
- Table 27. Types of FPGA-based solutions for AI acceleration. 81
- Table 28. Types of multi-chip module (MCM) integration approaches for AI chips. 82
- Table 29. 2D materials in AI hardware. 83
- Table 30. Photonic materials for AI hardware. 84
- Table 31. Spintronic materials for AI hardware. 84
- Table 32. Phase change materials for AI hardware. 85
- Table 33. Neuromorphic materials in AI hardware. 86
- Table 34. Techniques for combining chiplets and dies using advanced packaging for AI chips. 86
- Table 35. Types of sensors. 88
- Table 36. Key AI chip products and solutions targeting automotive applications. 99
- Table 37. AI versus non-AI smartphones 104
- Table 38. Key chip fabrication process nodes used by various mobile AI chip designers. 108
- Table 39. AI versus non AI tablets. 110
- Table 40. Market players in AI chips for personal, parallel, and low-precision computing. 116
- Table 41. AI chip company products for drones and robotics. 118
- Table 42. Applications of AI chips in wearable devices. 120
- Table 43. Applications of ai chips and sensors and structural health monitoring. 123
- Table 44. Applications of AI chips in life sciences. 125
- Table 45. AI chip costs analysis-design, operation and fabrication. 127
- Table 46. Design, manufacturing, testing, and operational costs associated with leading-edge process nodes for AI chips. 127
- Table 47. Assembly, test, and packaging (ATP) costs associated with manufacturing AI chips. 128
- Table 48. Global market revenues by chip type, 2020-2034 (billions USD). 129
- Table 49. Global market revenues by market, 2020-2034 (billions USD). 130
- Table 50. Global market revenues by region, 2020-2034 (billions USD). 132
- Table 51. AMD AI chip range. 136
- Table 52. Applications of CV3-AD685 in autonomous driving. 141
- Table 53. Evolution of Apple Neural Engine. 144
List of Figures
- Figure 1. Nvidia H200 AI Chip. 16
- Figure 2. History of AI development. 19
- Figure 3. AI roadmap. 49
- Figure 4. Nvidia A100 GPU . 68
- Figure 5. Google Cloud TPUs. 69
- Figure 6. Groq Node. 69
- Figure 7. Intel Movidius Myriad X. 71
- Figure 8. Qualcomm Cloud AI 100. 72
- Figure 9. Tesla FSD Chip. 73
- Figure 10. Qualcomm Snapdragon. 75
- Figure 11. AI chio market map. 94
- Figure 12. Global market revenues by chip type, 2020-2034 (billions USD). 130
- Figure 13. Global market revenues by market 2020-2034 (billions USD). 131
- Figure 14. Global market revenues by region, 2020-2034 (billions USD). 133
- Figure 15. AMD Radeon Instinct. 137
- Figure 16. AMD Ryzen 7040. 137
- Figure 17. Alveo V70. 137
- Figure 18. Versal Adaptive SOC. 138
- Figure 19. AMD’s MI300 chip. 138
- Figure 20. Cerebas WSE-2. 155
- Figure 21. DeepX NPU DX-GEN1. 161
- Figure 22. InferX X1. 170
- Figure 23. “Warboy”(AI Inference Chip). 171
- Figure 24. Google TPU. 172
- Figure 25. GrAI VIP. 173
- Figure 26. Colossus™ MK2 GC200 IPU. 175
- Figure 27. GreenWave’s GAP8 and GAP9 processors. 176
- Figure 28. Journey 5. 180
- Figure 29. IBM Telum processor. 183
- Figure 30. 11th Gen Intel® Core™ S-Series. 186
- Figure 31. Envise. 194
- Figure 32. Pentonic 2000. 198
- Figure 33. Meta Training and Inference Accelerator (MTIA). 199
- Figure 34. Azure Maia 100 and Cobalt 100 chips. 201
- Figure 35. Mythic MP10304 Quad-AMP PCIe Card. 205
- Figure 36. Nvidia H200 AI chip. 214
- Figure 37. Grace Hopper Superchip. 215
- Figure 38. Panmnesia memory expander module (top) and chassis loaded with switch and expander modules (below). 217
- Figure 39. Cloud AI 100. 220
- Figure 40. Peta Op chip. 223
- Figure 41. Cardinal SN10 RDU. 226
- Figure 42. MLSoC™. 231
- Figure 43. Grayskull. 237
- Figure 44. Tesla D1 chip. 238
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