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Global PiezoMEMS Market 2025-2035

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  • Published: January 2025
  • Pages: 262
  • Tables: 35
  • Figures: 32

 

Piezoelectric microelectromechanical sensors and actuators are used in a wide variety of applications. Compared to traditional capacitive MEMS, piezoelectric MEMS deliver superior performance and manufacturing efficiency. Piezoelectric thin films, particularly PZT, form the new basis for high-growth MEMS products such as microphones and micromirrors, gas sensors, image stabilizers, ultrasonic transducers, piezo printers that deliver excellent printing results, AR glasses and RF filters for enhanced telecommunications. 

The piezoMEMS sector represents a significant segment within the broader MEMS industry, with particularly strong presence in consumer electronics, telecommunications, and emerging IoT applications. The piezoMEMS market is expected to grow significantly faster than the broader MEMS  driven by:

  • Expansion of 5G networks and eventual 6G development
  • Increasing adoption in automotive safety and autonomous systems
  • Growth in medical imaging and diagnostic applications
  • Emergence of new consumer electronics applications

 

The emergence of new applications, particularly in IoT, automotive, and medical sectors, is expected to drive sustained growth through 2035, with potential for breakthrough applications in emerging fields such as quantum computing and advanced sensing systems.

The Global PiezoMEMS Market 2025-2035 report analyzes the global piezoelectric MEMS (PiezoMEMS) sector, providing detailed insights into technology developments, market trends, and growth opportunities from 2025 to 2035. The study examines the entire value chain from materials and manufacturing to end-user applications, with particular focus on emerging technologies and market dynamics. Report contents include: 

  • Extensive analysis of the PiezoMEMS industry, including detailed market forecasts, technology assessments, and competitive analysis.
  • Key applications such as RF filters, sensors, actuators, and transducers across various sectors including consumer electronics, automotive, medical, and industrial applications.
  • Key Market Segments covered include:
    • Sensors (microphones, accelerometers, force sensors)
    • Actuators (inkjet printheads, microspeakers, optical MEMS)
    • Transducers (ultrasonic fingerprint sensors, medical imaging)
    • RF Filters (BAW technology, FBAR/SMR solutions)
  • Detailed market analysis including:
    • Global revenue projections (2025-2035)
    • Volume forecasts by device type
    • Regional market analysis
    • Production capacity assessment
    • Wafer-level analysis
    • Supply chain evaluation
  • Technology roadmaps and development trends
  • Manufacturing strategies and challenges
  • Regional market dynamics
  • Detailed analysis of key application areas:
    • Consumer electronics (smartphones, wearables)
    • Automotive sensors and actuators
    • Medical devices and imaging systems
    • Industrial applications
    • IoT and emerging applications
  • Manufacturing and Production:
    • Wafer fabrication processes
    • Integration technologies
    • Quality control methods
    • Capacity utilization
    • Regional production distribution
    • Cost analysis
  • Technology Trends and Innovation:
    • Material innovations and enhancements
    • Manufacturing advances
    • Device miniaturization
    • Performance improvements
    • Novel applications
    • Integration strategies
  • Market opportunities and growth drivers:
    • Technical barriers and solutions
    • Market adoption factors
    • Competition analysis
    • Environmental considerations
    • Regulatory compliance
    • Future opportunities
  • Comprehensive profiles of over 150 companies including:
    • Major MEMS manufacturers
    • Material suppliers
    • Equipment providers
    • Technology developers
    • End-product manufacturers

Companies covered include Abbott, Aeponyx, AKM, Akoustis, AlphaMOS, Alps Alpine, Amphenol, Analog Devices, Anello Photonics, Apple, Arioso, ASAIR, Asia Pacific Microsystems, ASMC, Aspinity, Atomica, Audiopixels, Beijing Zhixin Tech, Blickfeld, Boehringer Ingelheim Microparts, Bosch, Broadcom, Butterfly Networks, Canon, Cartesiam, CEA Leti, Chongqing Silian Sensor Technology, Cirrus Logic, Colibrys, CRMicro, Denso, DRS, EPCOS, EpicMEMS, eXo Imaging, Figaro, Flusso, Formfactor, Fraunhofer IPMS, Fujifilm Dimatix, Gettop, GMEMS Technologies, Goermicro, Goertek, Google, Guide IR, GWIC, Hanking Electronics, Heimann Sensor, Hewlett Packard, Hikvision, Honeywell, HuaHong Grace, Huntersun, Hypernano, IceMOS, Illumina, IMEC, Infineon Technologies, IonTorrent, LAM Research, Lynred, Maxim, Mekonos, Melexis, MEMJET, MEMSCAP, MEMSDrive, MEMSensing, MEMSIC, MEMSonics, MEMSRight, MenloMicro, Merit Sensor, Merry Electronics, Microchip, Microfab, Micronit, Minebea Mitsumi, Mirrorcle, Murata, Nanox, Novosense, NXP, Okmetic, Omnitron Sensors, One Silicon Chip Photonics, OQmented, Oriental System Technology, Panasonic, Partron, Philips Engineering Solution, poLight ASA, Posifa Technologies, Preciseley, Qorvo, Qualcomm, Raytheon, Ricoh, Resonant, Robosense, Rohm, Safran Sensing Technologies, Samsung, Sappland Microelectronics, ScioSense, Seiko Epson Corporation, Semefab, Senba Sensing, Sensata, sensiBel, Sensirion, Sercalo, Silicon Austria Labs, Silicon Design Inc, Silicon Sensing Systems, Silex Microsystems/SMEI, SiTime, Skyworks, SMIC, Sofant Technologies, Soitec, Sonic Edge, Sonion, Sumitomo
Precision, TDK Electronics and more.

 

Download Table of Contents (PDF)

1             INTRODUCTION          17

  • 1.1        The Global MEMS market       17
    • 1.1.1    Historical          17
    • 1.1.2    Current market (2024-2025) 18
  • 1.2        Overview of Piezoelectric Technology            20
    • 1.2.1    Fundamentals of Piezoelectricity      20
    • 1.2.2    Direct and Inverse Piezoelectric Effects       21
    • 1.2.3    Key Parameters and Measurements               23
    • 1.2.4    Design Considerations            24
  • 1.3        Evolution of PiezoMEMS Technology              25
  • 1.4        PiezoMEMS Market 2020-2024          27
    • 1.4.1    Market Size and Growth Trends         27
    • 1.4.2    Application Development      28
    • 1.4.3    Technology Advancement     30
  • 1.5        Technology Landscape           31
    • 1.5.1    Core Technologies      31
    • 1.5.2    Integration Approaches          34
    • 1.5.3    Competing Technologies       35
    • 1.5.4    Technology Readiness Levels              36
  • 1.6        Regulatory Framework             37

 

2             PIEZOELECTRIC MATERIALS AND TECHNOLOGIES             39

  • 2.1        Fundamentals of Piezoelectric Materials    40
    • 2.1.1    Working Principles      40
      • 2.1.1.1 Crystal Structure         40
      • 2.1.1.2 Polarization Mechanisms      41
      • 2.1.1.3 Electromechanical Coupling              42
      • 2.1.1.4 Material Physics           43
    • 2.1.2    Key Performance Metrics       44
    • 2.1.3    Manufacturing Processes      44
  • 2.2        Material Categories    48
    • 2.2.1    Aluminum Nitride (AlN)           48
      • 2.2.1.1 Properties and Characteristics          49
      • 2.2.1.2 Applications   50
      • 2.2.1.3 Cost Structure               50
    • 2.2.2    Scandium-doped AlN               51
      • 2.2.2.1 Doping Effects               51
      • 2.2.2.2 Performance Improvements                52
      • 2.2.2.3 Manufacturing Challenges   53
      • 2.2.2.4 Cost-Benefit Analysis              54
      • 2.2.2.5 Market Adoption          55
    • 2.2.3    Lead Zirconate Titanate (PZT)              56
      • 2.2.3.1 Material Properties     56
      • 2.2.3.2 Processing Methods 57
      • 2.2.3.3 Performance Characteristics              58
      • 2.2.3.4 Environmental Concerns       58
      • 2.2.3.5 Application Areas       59
    • 2.2.4    Emerging Materials    60
      • 2.2.4.1 KNN      60
      • 2.2.4.2 LiNbO3              61
  • 2.3        Processing Technologies        64
    • 2.3.1    Thin-film Deposition 64
      • 2.3.1.1 Sputtering Techniques             64
      • 2.3.1.2 Chemical Vapor Deposition 65
      • 2.3.1.3 Sol-Gel Processing    66
      • 2.3.1.4 Other Methods             67
    • 2.3.2    Integration Techniques            68
      • 2.3.2.1 CMOS Integration       68
      • 2.3.2.2 Wafer Bonding              69
      • 2.3.2.3 Packaging Solutions 70
    • 2.3.3    Quality Control Methods        72

 

3             MARKET ANALYSIS AND FORECASTS 2025-2035  74

  • 3.1        Market Size and Growth          75
    • 3.1.1    Global Revenue Projections 75
    • 3.1.2    Volume Forecasts       77
      • 3.1.2.1 Unit Production Trends            77
      • 3.1.2.2 Volume by Device Type            78
      • 3.1.2.3 Production Capacity Analysis            79
      • 3.1.2.4 Capacity Utilization Rates     80
    • 3.1.3    Regional Analysis       82
      • 3.1.3.1 North America              82
      • 3.1.3.2 Europe                84
      • 3.1.3.3 Asia Pacific     85
      • 3.1.3.4 China  86
  • 3.2        Market Segmentation               86
    • 3.2.1    By Device Type              87
    • 3.2.2    By Material Type           88
    • 3.2.3    By End-user Industry 89
  • 3.3        Wafer-level Analysis 90
    • 3.3.1    Wafer Starts by Material          91
    • 3.3.2    Wafer Size Trends        91
    • 3.3.3    Manufacturing Capacity         92
    • 3.3.4    Regional Production Distribution     93

 

4             APPLICATION SEGMENTS     94

  • 4.1        Sensors             94
    • 4.1.1    Microphones  94
    • 4.1.2    Accelerometers            95
    • 4.1.3    Force Sensors               96
    • 4.1.4    Market Forecast           96
  • 4.2        Actuators          98
    • 4.2.1    Inkjet Printheads         98
    • 4.2.2    Microspeakers              99
    • 4.2.3    Optical MEMS               100
    • 4.2.4    Market Forecast           102
  • 4.3        Transducers    104
    • 4.3.1    Ultrasonic Fingerprint Sensors           104
    • 4.3.2    Medical Imaging          106
    • 4.3.3    Market Forecast           106
  • 4.4        RF Filters           108
    • 4.4.1    BAW Technology          109
    • 4.4.2    FBAR/SMR Solutions 110
    • 4.4.3    Market Forecast           111

 

5             SUPPLY CHAIN              113

 

6             TECHNOLOGY TRENDS AND INNOVATION               115

  • 6.1        Material Innovations 115
    • 6.1.1    Enhanced Performance Materials    115
    • 6.1.2    Lead-free Alternatives              116
    • 6.1.3    Novel Compositions 118
  • 6.2        Manufacturing Advances       120
    • 6.2.1    Process Improvements           120
    • 6.2.2    Integration Technologies        121
    • 6.2.3    Quality Control Methods        122
  • 6.3        Device Innovations    123
    • 6.3.1    Miniaturization Trends             123
    • 6.3.2    Performance Enhancements              125
    • 6.3.3    New Applications        126

 

7             CHALLENGES AND OPPORTUNITIES             127

  • 7.1        Technical Challenges               127
  • 7.2        Market Barriers             129
  • 7.3        Growth Opportunities              130
  • 7.4        Future Applications   132

 

8             COMPANY PROFILES                134 (156 company profiles)

 

9             APPENDICES  261

  • 9.1        Research Methodology           261
  • 9.2        Abbreviations 262
  • 9.3        References      263

 

List of Tables

  • Table 1. Global MEMS market 2020-2024 (Billion USD), by end user market.      19
  • Table 2. Key piezoelectric parameters and their significance.       23
  • Table 3. Core Technologies in PiezoMEMS. 31
  • Table 4. PiezoMEMS Integration Approaches.          34
  • Table 5. Comparison of competing technologies. 35
  • Table 6. PiezoMEMS Technology Readiness Levels.              36
  • Table 7. Key regulations affecting piezoMEMS industry.    38
  • Table 8. PiezoMEMS key performance metrics.       44
  • Table 9. PiezoMEMS Manufacturing Processes.      44
  • Table 10. AlN properties and applications  50
  • Table 11. Sc-AlN vs standard AlN comparison.       55
  • Table 12. PZT variations and properties.       56
  • Table 13. PZT performance metrics.               58
  • Table 14. Emerging materials comparison. 62
  • Table 15. Technology readiness assessment.          63
  • Table 16. Deposition technology comparison.        67
  • Table 17. Process parameters for different methods.         68
  • Table 18. Integration challenges and solutions.     71
  • Table 19. Global PiezoMEMS market revenue forecast 2020-2035 (Billions USD).          75
  • Table 20. Capacity utilization rates. 80
  • Table 21. Production volumes by device type, 2020-2035.             80
  • Table 22. Global PiezoMEMS revenues by device type 2020-2035.            87
  • Table 23. Global PiezoMEMS revenues by material type 2020-2035.        88
  • Table 24. Global PiezoMEMS revenues by end-user industry 2020-2035.             89
  • Table 25. Wafer production trends. 90
  • Table 26. PiezoMEMS wafer share by fab.   91
  • Table 27. Global PiezoMEMS market forecast in Sensors (2024-2035).  97
  • Table 28. Global PiezoMEMS market forecast in Actuators (2024-2035).              102
  • Table 29. Global PiezoMEMS market forecast in Transducers (2024-2035).        107
  • Table 30. Global PiezoMEMS market forecast in Transducers (2024-2035).        111
  • Table 31. Enhanced Performance Materials for PiezoMEMS.         115
  • Table 32. PiezoMEMS Lead-free Alternatives.           117
  • Table 33. PiezoMEMS technical challenges.              127
  • Table 34. Market barriers.      129
  • Table 35. Future applications analysis.        132

 

List of Figures

  • Figure 1. Global MEMS market 2020-2024 (Millions USD), by end user market. 20
  • Figure 2. Schematic illustration of piezoelectric effect.     21
  • Figure 3. Evolution of PiezoMEMS Technology.         25
  • Figure 4. PiezoMEMS Market 2020-2024 (Billion USD).      28
  • Figure 5. Manufacturing process flow diagram.      45
  • Figure 6. PiezoMEMS material roadmap.     48
  • Figure 7. Integration process flows. 70
  • Figure 8. Global PiezoMEMS market revenue forecast 2020-2035 (Billions USD).           76
  • Figure 9. Production volumes by device type, 2020-2035.              81
  • Figure 10.  Global PiezoMEMS revenues by device type 2020-2035.         88
  • Figure 11. Global PiezoMEMS revenues by material type 2020-2035.      89
  • Figure 12.  Global PiezoMEMS revenues by end-user industry 2020-2035.          90
  • Figure 13. Wafer capacity by region.               93
  • Figure 14. Global PiezoMEMS market forecast in Sensors (2024-2035). 97
  • Figure 15. Global PiezoMEMS market forecast in Actuators (2024-2035).            102
  • Figure 16. Global PiezoMEMS market forecast in Transducers (2024-2035).      108
  • Figure 17. Global PiezoMEMS market forecast in Transducers (2024-2035).      111
  • Figure 18. PiezoMEMS Market supply chain.             113
  • Figure 19. Bosch - BMI270 6-axis IMU.          153
  • Figure 20. Broadcom - FBAR RF Filter Products.     154
  • Figure 21. Butterfly Network - Butterfly iQ+ Ultrasound System. 155
  • Figure 22. Fujifilm Dimatix - Samba Printhead Technology.             174
  • Figure 23. Infineon - XENSIV™ MEMS Microphones.             187
  • Figure 24. Murata - SAW Filter Products.     191
  • Figure 25. poLight - TLens® Autofocus Actuator.     201
  • Figure 26. Qorvo - BAW Filter Portfolio.         204
  • Figure 27. Qualcomm - 3D Sonic Sensor (Ultrasonic Fingerprint).             206
  • Figure 28. STMicroelectronics - MEMS microphones (MP23DB01HP).   239
  • Figure 29. TDK InvenSense - ICP-10125 High-Performance Pressure Sensor.     242
  • Figure 30. Vesper - VM3000 Piezoelectric MEMS Microphone.     250
  • Figure 31. USound - MEMS Speaker Technology.    256
  • Figure 32. xMEMS - Montara Microspeaker.               259

 

 

 

Global PiezoMEMS Market 2025-2035
Global PiezoMEMS Market 2025-2035
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