The Global Market for In-mold Electronics (IME) 2025-2035 - Advanced and Emerging Technology Market Research

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Published: January 2025
Pages: 91
Tables: 48
Figures: 18

In-mold electronics (IME), also sometimes known as plastronics, is an innovative technology that combines traditional injection molding with printed electronics. This process allows for the embedding of functional electronic elements, such as touch sensors, displays, and lighting, directly into plastic components during the molding process. This process allows for the creation of smart surfaces and complex electronic functionalities within a single manufacturing step. IME technology enables the embedding of touch sensors, lighting, and other electronic functionalities into 3D molded surfaces, resulting in streamlined manufacturing processes and reduced assembly costs. This not only enhances product performance but also improves aesthetics by removing the need for external components.

The advantages of IME include:

Design Flexibility: IME enables the creation of complex shapes and designs that are not possible with traditional electronics integration methods.
Durability: The electronic components are protected within the molded plastic, making them more resistant to wear and environmental factors.
Cost Efficiency: By integrating multiple functions into a single part, IME can reduce assembly costs and improve manufacturing efficiency.

IME technology typically involves a three-step process:

Printing of Electronic Circuits: This step includes the application of conductive inks to create the necessary electronic pathways.
Forming: The printed circuits are then formed into the desired shape, which is crucial for ensuring that the electronics fit seamlessly into the final product.
Molding: Finally, the formed circuits are encapsulated within a molded part, creating a durable and functional electronic component that can be used in various applications, such as automotive interiors, consumer electronics, and medical devices.

IME products are particularly beneficial in industries such as automotive, consumer electronics, and medical devices, where space and weight savings are critical. The technology not only enhances product design but also improves durability and performance by eliminating the need for separate electronic assemblies, enabling the creation of user-friendly interfaces and complex electronic systems within a single molded part. IME products are designed to meet the growing demand for smart, connected devices, enabling manufacturers to innovate and differentiate their offerings in competitive markets.

The Global Market for In-Mold Electronics (IME) 2025-2035 provides an in-depth analysis of the rapidly growing global in-mold electronics (IME) market, examining key trends, technologies, materials, applications, and market forecasts from 2025 to 2035. The study offers detailed insights into this transformative technology that integrates electronic functionality directly into molded plastic components, revolutionizing manufacturing across multiple industries. The report provides extensive coverage of IME manufacturing processes, including detailed analysis of production methods, component integration, and material requirements. Key focus areas include surface functionalization technologies, conductive inks, transparent conductors, and substrate materials essential for successful IME implementation.

Market analysis covers major application sectors including:

Automotive human-machine interfaces
White goods and appliances
Medical devices
Industrial controls
Wearable electronics

The study examines critical aspects of IME technology including:

Manufacturing processes and requirements
Component integration strategies
Materials development and selection
Quality control and testing
Regulatory considerations
Sustainability aspects

Technical coverage includes detailed analysis of:

Conductive ink formulations
Transparent conductive materials
Substrate and thermoplastic selection
Integration of electronic components
Surface treatment technologies
Testing and validation methods

The report features comprehensive market data including:

Market size and growth projections (2025-2035)
Revenue forecasts by application sector
Regional market analysis
Technology adoption trends
Competitive landscape assessment. The report profiles leading companies across the IME value chain, including Canatu, CHASM Technologies, Covestro, Dupont, E2IP Technologies, Elantas, Embega, FORVIA Faurecia, Genes'Ink, Henkel, Kimoto, Nissha, TactoTek Oy, and more. These companies represent various segments of the IME industry including material suppliers, equipment manufacturers, technology developers, and end-product manufacturers.

Special focus is placed on emerging technologies and innovations:

Advanced material developments
Novel manufacturing processes
Integration strategies
Future technology roadmaps
Market opportunities and challenges

This comprehensive report serves as an essential resource for:

Material manufacturers
Electronics manufacturers
Automotive companies
Consumer electronics brands
Medical device manufacturers
Investment firms
R&D organizations
Strategic planners

1 EXECUTIVE SUMMARY 11

1.1 Design limitations on surfaces 11
1.2 Applications 13
1.3 IME manufacturing 16
1.4 Investments 18
1.5 Sustainability 19
1.6 Market outlook 19
1.7 Market forecasts 22

2 INTRODUCTION 25

2.1 Functionality Integration 25
2.2 3D Electronics 26
- 2.2.1 Printing of Electronics on Multiple Sides 28
- 2.2.2 Conformal Electronics Printing on 3D Surfaces 28
- 2.2.3 Electronics Printing in Hollow Objects 29
2.3 IME Value Chain 29

3 IME MANUFACTURING 31

3.1 IME components 31
3.2 IME production 32
3.3 Implementation approaches 32
- 3.3.1 Hybrid 32
- 3.3.2 One-film vs two-film 33
- 3.3.3 Implementation of multilayer circuits 33
- 3.3.4 Integration of integrated circuits in IME 33
- 3.3.5 Print-then-plate 34
- 3.3.6 Automation 34
- 3.3.7 Transfer printing technology 35
- 3.3.8 Evaporated line technology 35
- 3.3.9 Capacitive touch functionality 35
3.4 Other manufacturing methods 35
3.5 Functional film bonding 36
3.6 Metallization Methods 37
3.7 MID technology 37
- 3.7.1 Aerosol deposition 38
- 3.7.2 Laser Direct Structuring (LDS) 38
- 3.7.3 Two shot molding 39
- 3.7.4 3D surfaces 39
- 3.7.5 Impulse printing technology 40
- 3.7.6 Pad printing 40
- 3.7.7 Spray metallization 40
3.8 Multifunctional composites 40
3.9 Additive manufacturing 41

4 IME COMPONENTS INTEGRATION 42

4.1 Capacitive sensing technology 42
- 4.1.1 Overview 42
- 4.1.2 Operation 42
4.2 Lighting 43
4.3 Haptics 44
4.4 3D Displays 44
4.5 Antenna 44

5 MATERIALS FOR IME 45

5.1 Overview 45
5.2 Conductive inks 46
- 5.2.1 Materials 47
- 5.2.2 Stretchable inks 47
- 5.2.3 Inks for IME 49
5.3 Dielectric inks 50
5.4 Electrically conductive adhesives 50
5.5 Transparent conductive materials 51
- 5.5.1 Overview 51
- 5.5.2 Types 51
- 5.5.3 Carbon nanotube (CNT) films 52
- 5.5.4 Poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) 52
- 5.5.5 Carbon nanobuds 53
- 5.5.6 Metal mesh 53
5.6 Substrate and thermoplastic materials 53

6 MARKETS FOR IME 55

6.1 Automotive 55
- 6.1.1 Overview 55
- 6.1.2 Commercial applications 56
  - 6.1.2.1 Sensing 56
  - 6.1.2.2 Headlamp covers 57
  - 6.1.2.3 Steering Wheel 58
- 6.1.3 Global market forecast 58
6.2 White Goods 59
- 6.2.1 Overview 59
- 6.2.2 Applications 60
- 6.2.3 Global market forecast 61
6.3 Medical Devices 62
- 6.3.1 Overview 62
- 6.3.2 Applications 62
- 6.3.3 Global market forecast 63
6.4 Industrial 64
- 6.4.1 Overview 64
- 6.4.2 Applications 64
6.5 Wearable Electronics 65
- 6.5.1 Overview 65
- 6.5.2 Applications 66
6.6 Other Markets and Applications 66

7 COMPANY PROFILES 68 (28 company profiles)

8 REFERENCES 90

List of Tables

Table 1. Surface Functionalization Technologies Comparison 11
Table 2. Electronics Manufacturing Technologies 12
Table 3. In-Mold Electronics Applications. 15
Table 4. IME Manufacturing Requirements. 16
Table 5. Competing Manufacturing Methods. 17
Table 6. Smart Surface Manufacturing Methods. 18
Table 7. Investment in In-Mold Electronics 18
Table 8. IME Applications and Stage of Development. 20
Table 9. IME Benefits and Challenges. 21
Table 10. Global Market Forecast for IME Component Area by Application, 2025-2035 (m²). 22
Table 11. Global Market Forecast for IME Revenue by Application, 2025-2035 (US$ Millions). 23
Table 12. In-mold Electronics Applications and Markets. 25
Table 13. Approaches to 3D Printed Electronics. 27
Table 14. Manufacturing of IME Components. 31
Table 15. Manufacturing Methods Comparison 32
Table 16. IME Production Equipment. 32
Table 17. IC Package Requirements for IME. 34
Table 18. Process Comparison. 36
Table 19. Comparison of Metallization Methods. 37
Table 20. MID Manufacturing Methods Comparison 37
Table 21. Applications of LDS. 38
Table 22. Applications for Printing Wiring onto 3D Surfaces. 39
Table 23. Processes for 3D Electronics. 41
Table 24. Printed Capacitive Sensor Technologies. 42
Table 25. Conventional Backlighting vs Integrated Lighting with IME. 43
Table 26. Materials for IME. 45
Table 27. Material Composition comparison of IME vs Conventional HMI. 45
Table 28. IME Materials companies. 46
Table 29. Conductive Ink Materials 47
Table 30. In-mold Conductive Inks. 49
Table 31. Conductive Ink Requirements for IME. 49
Table 32. Properties of Stretchable/Thermoformable Conductive Inks 49
Table 33. Types of Conductive Adhesives. 50
Table 34. Transparent Conductive Materials for IME. 51
Table 35. Carbon Nanotube In-mold Films. 52
Table 36. PEDOT:PSS Films 53
Table 37. Substrates and Thermoplastics for IME. 53
Table 38.IME in Automotive HMI. 55
Table 39. Commercial Automotive In-mold Decoration. 56
Table 40. Global market forecast for IME in the Automotive Market 2025-2035 (USD Millions). 58
Table 41. Applications of IME in White Goods. 60
Table 42. Example IME for White Goods products. 61
Table 43. Global market forecast for IME in White Goods Market 2025-2035 (USD Millions). 61
Table 44. Medical Device Applications. 62
Table 45. Global market forecast for IME in Medical Devices Market 2025-2035 (USD Millions). 63
Table 46. Industrial IME Applications 64
Table 47. Wearable IME Applications. 66
Table 48. Other markets and applications for IME. 67

List of Figures

Figure 1. Examples of Structural Electronics. 12
Figure 2. IME device. 14
Figure 3. Examples of various companies producing IME. 15
Figure 4. IME manufacturing process flow. 17
Figure 5. Global Market Forecast for IME Component Area by Application, 2025-2035 (m²). 23
Figure 6. Global Market Forecast for IME Revenue by Application, 2025-2035 (US$ Millions). 24
Figure 7. Structural Difference in 3D Printed Electronics. 27
Figure 8. Example Electronics on 3D Surfaces. 28
Figure 9. IME Value Chain. 30
Figure 10. LG Display stretchable display. 48
Figure 11. Cross-section of a capacitive touch sensor. 57
Figure 12. Thermally conductive automotive heat-sink with in-mold electronics. 58
Figure 13. Global market forecast for IME in the Automotive Market 2025-2035 (USD Millions). 59
Figure 14. Top panel of the remote control, made with in-mold decoration (IMD). 60
Figure 15. Global market forecast for IME in White Goods Market 2025-2035 (USD Millions). 61
Figure 16. Global market forecast for IME in Medical Devices Market 2025-2035 (USD Millions). 64
Figure 17. 3D transparent touch panel produced by Canatu and Faurecia. 72
Figure 18. Origo Steering Wheel. 73

The Global Market for In-mold Electronics (IME) 2025-2035

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