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The Global Silicon Photonics Market 2025-2035

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  • Published: November 2024
  • Pages: 321
  • Tables: 130
  • Figures: 39

 

The silicon photonics market represents a transformative force in semiconductor and optical communications technology, merging optical data transmission capabilities with traditional silicon semiconductor manufacturing. This integration enables unprecedented performance in data transmission speed, power efficiency, and computational capabilities while maintaining cost-effectiveness through established manufacturing processes. The current market is experiencing robust growth driven by several key factors. Data center expansion and cloud computing continue to demand higher bandwidth solutions, while 5G network deployments push the boundaries of telecommunications infrastructure. The rising global demand for high-speed internet, coupled with the exponential growth in artificial intelligence and machine learning applications, creates an increasingly compelling case for silicon photonics adoption.

The technology has found its strongest foothold in data centers and high-performance computing environments, where it serves as the backbone for high-speed interconnects between servers. These applications benefit from silicon photonics' ability to transmit data at higher speeds while significantly reducing power consumption compared to traditional electronic solutions. The telecommunications sector represents another major market segment, with applications ranging from 5G infrastructure to long-haul communications and metro networks.

Healthcare and biosensing applications are emerging as promising growth areas, with silicon photonics enabling advances in medical diagnostics, biological sensors, point-of-care testing devices, and DNA sequencing applications. This diversification of applications demonstrates the technology's versatility and potential for market expansion. Emerging applications are set to drive future growth, with quantum computing, LiDAR systems for autonomous vehicles, and artificial intelligence accelerators leading the way. The edge computing infrastructure's expansion also creates new opportunities for silicon photonics implementation. However, the industry faces several key challenges. Future market evolution will likely be shaped by several key trends, including increased integration density and miniaturization of components, enhanced functionality per chip, and improved power efficiency. New applications in neuromorphic computing, quantum photonics, and advanced sensing systems continue to emerge, while biomedical devices represent a promising growth sector.

Manufacturing evolution remains crucial to market growth, with advances in automated testing and characterization, improved yield management, and cost reduction through scale. The industry's ability to overcome current technical and commercial challenges while capitalizing on emerging opportunities will determine the ultimate realization of silicon photonics' market potential. As the technology continues to mature and find new applications, its role in shaping the future of computing and communications becomes increasingly central to global technological advancement.

The Global Silicon Photonics Market 2025-2035 provides an in-depth analysis of the rapidly evolving industry, covering market trends, technological developments, and growth opportunities from 2025 to 2035. The report examines the convergence of optical and electronic technologies, highlighting how silicon photonics is revolutionizing data centers, telecommunications, sensing applications, and emerging quantum computing solutions.

Report contents include:

  • Detailed market forecasts spanning 2025-2035
  • Comprehensive analysis of key application segments
  • In-depth evaluation of materials and components
  • Assessment of advanced packaging technologies
  • Complete supply chain analysis
  • Extensive company profiles of 180+ market players. Companies profiled include Accelink Technologies, Aeva Technologies, Aeponyx, Advanced Fiber Resources, AIM Photonics, AIO Core, Alibaba Cloud, Amazon (AWS), ANSYS, Advanced Micro Foundry, Amkor Technology, AMO GmbH, Analog Photonics, Anello Photonics, Aryballe, A*STAR, ASE Holdings, Aurora Innovation, Axalume, AXT, Ayar Labs, Baidu, Bay Photonics, BE Epitaxy Semiconductor, Broadcom, Black Semiconductor, Broadex, ByteDance, Cadence, CEA LETI, Celestial AI, Centera Photonics, Cambridge Industries Group, Ciena, CISCO Systems, CNIT, Coherent Corp., CompoundTek, Cornerstone, Crealights Technology, DustPhotonics, EFFECT Photonics, Eoptolink, Ephos, Epiphany, Fabrinet, Fast Photonics, Fiberhome, Fibertop, ficonTEC, FormFactor, Fujitsu, Genalyte, Gigalight, GlobalFoundries, HGGenuine, Hisense Broadband, HyperLight, HyperPhotonix, Icon Photonics, InnoLight Technology, Innosemi, IntelliEpi, Inphotec, Intel, Imec, IMECAS, iPronics, JABIL, JCET Group, JFS Laboratory, JSR Corporation, Juniper Networks, Ki3 Photonics, LandMark, Leoni AG, Ligentec, Lightelligence, Lightium, Lightmatter, Lightsynq Technologies, Lightwave Logic, Light Trace Photonics, Liobate Technologies, LioniX International, LPKF, Lumentum, Luceda, Luminous Computing, LuminWave Technology, Lumiphase AG, Luxshare Precision Industry, Luxtelligence SA, MACOM, Marvell, Molex, NanoLN, NEC Corporation, NewPhotonics, NGK Insulators, NLM Photonics, Nokia Corporation, Novel Si Integration Technology, NTT Corporation, Nvidia, O-Net, OpenLight Photonics, OriChip Optoelectronics Technology, Partow Technologies, PETRA, Phix, Photonic Inc., POET Technologies, Pointcloud, Polariton Technologies, PsiQuantum, Q.ANT, QC82, Quandela, Quantum Computing Inc., Quantum Source, Quantum Transistors, Quintessent, QuiX Quantum, Qutronix, Rain Tree Photonics, Ranovus, Rapid Photonics, Salience Labs, Samsung, Sanan IC and more....
  • Market Segments analysed include:
    • Datacom and High-Performance Computing
    • Telecommunications Infrastructure
    • Sensing and LiDAR Systems
    • AI and Machine Learning
    • Quantum Computing
    • Neuromorphic Computing
    • Biophotonics and Medical Diagnostics
  • Critical technology components:
    • Core Components (lasers, modulators, photodetectors)
    • Integration Technologies
    • Advanced Packaging Solutions
    • Materials (Silicon, Germanium, Silicon Nitride, Lithium Niobate)
    • Wafer Processing and Manufacturing
    • Co-Packaged Optics
    • 2.5D and 3D Integration
  • Market Drivers and Opportunities
  • Comprehensive coverage of the silicon photonics ecosystem including:
    • Foundries and Wafer Suppliers
    • Integrated Device Manufacturers
    • Fabless Companies
    • Packaging and Testing Providers
    • System Integrators
    • End-Users
  • Emerging Technologies:
    • Novel Integration Techniques
    • Advanced Modulator Technologies
    • Next-Generation Photodetectors
    • Innovative Waveguide Designs
    • Breakthrough Packaging Solutions
  • Manufacturing and Integration
    • CMOS-Compatible Manufacturing
    • Wafer-Scale Integration
    • Hybrid and Heterogeneous Integration
    • Yield Management
    • Cost Optimization Strategies
  • Challenges and Solutions:
    • Thermal Management
    • Packaging Complexity
    • Integration Challenges
    • Cost Reduction Strategies
    • Scaling and Miniaturization
    • Testing and Characterization
  • Detailed profiles of 180+ companies including:
      • Major Semiconductor Manufacturers
      • Specialized Photonics Companies
      • Research Institutions
      • Start-ups and Innovators
      • System Integrators
      • Technology Providers

 

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1             EXECUTIVE SUMMARY            20

  • 1.1        Market Overview          20
  • 1.2        Electronic and Photonic Integration Compared      21
  • 1.3        Silicon Photonic Transceiver Evolution         21
  • 1.4        Market Map     22
  • 1.5        Global Market Trends in Silicon Photonics 25
  • 1.6        Competing and Complementary Photonics Technologies               26
    • 1.6.1    Metaphotonics             29
    • 1.6.2    III-V Photonics               29
    • 1.6.3    Lithium Niobate Photonics   29
    • 1.6.4    Polymer Photonics     30
    • 1.6.5    Plasmonic Photonics               30
  • 1.7        Potential of photonic AI acceleration             30
  • 1.8        Commercial deployment of silicon photonics         31
  • 1.9        Manufacturing challenges    32

 

2             INTRODUCTION TO SILICON PHOTONICS 34

  • 2.1        What is Silicon Photonics?   35
    • 2.1.1    Definition and Principles of Silicon Photonics         35
    • 2.1.2    Comparison with traditional technologies 35
    • 2.1.3    Silicon and Photonic Integrated Circuits      36
    • 2.1.4    Optical IO, Coupling and Couplers  37
    • 2.1.5    Emission and Photon Sources/Lasers           38
    • 2.1.6    Detection and Photodetectors           38
    • 2.1.7    Compound Semiconductor Lasers and Photodetectors (III-V)     38
    • 2.1.8    Modulation, Modulators, and Mach-Zehnder Interferometers      39
    • 2.1.9    Light Propagation and Waveguides 40
    • 2.1.10 Optical Component Density                41
  • 2.2        Advantages of Silicon Photonics      42
  • 2.3        Applications of Silicon Photonics    43
  • 2.4        Comparison with Other Photonic Integration Technologies            43
  • 2.5        Evolution from Electronic to Photonic Integration 44
  • 2.6        Silicon Photonics vs Traditional Electronics              45
  • 2.7        Modern high-performance AI data centers 45
  • 2.8        Core Technology Components          48
    • 2.8.1    Optical IO, Coupling and Couplers  48
    • 2.8.2    Emission and Photon Sources/Lasers           49
      • 2.8.2.1 III-V Integration Challenges  50
      • 2.8.2.2 Laser Integration Approaches            50
    • 2.8.3    Detection and Photodetectors           50
    • 2.8.4    Modulation Technologies       51
      • 2.8.4.1 Mach-Zehnder Interferometers          51
      • 2.8.4.2 Ring Modulators           52
    • 2.8.5    Light Propagation and Waveguides 52
    • 2.8.6    Optical Component Density                53
  • 2.9        Basic Optical Data Transmission     53
  • 2.10     Silicon Photonic Circuit Architecture             54

 

3             MATERIALS AND COMPONENTS       56

  • 3.1        Silicon 56
    • 3.1.1    Silicon as a Photonic Material             56
      • 3.1.1.1 Optical Properties of Silicon 56
      • 3.1.1.2 Fabrication Processes for Silicon Photonics             56
    • 3.1.2    Silicon and Silicon-on-insulator (SOI)           57
      • 3.1.2.1 SOI Manufacturing Process  58
      • 3.1.2.2 SOI Performance Benchmarks           61
      • 3.1.2.3 Key SOI Players             61
  • 3.2        Germanium    62
    • 3.2.1    Germanium Integration in Silicon Photonics            62
    • 3.2.2    Germanium Photodetectors                62
    • 3.2.3    Germanium-on-Silicon Modulators                63
  • 3.3        Silicon Nitride                63
    • 3.3.1    Silicon Nitride (SiN) in Photonics Integrated Circuits           63
    • 3.3.2    Optical Properties and Fabrication of SiN   65
    • 3.3.3    SiN Modulator Technologies                66
    • 3.3.4    SiN Applications in Photonics Integrated Circuits 66
    • 3.3.5    Advances in SiN Modulator Technologies   67
    • 3.3.6    SiN-based Waveguides and Devices              67
    • 3.3.7    SiN Performance Analysis    68
    • 3.3.8    Applications of SiN in Photonics       69
    • 3.3.9    SiN PIC Players             69
  • 3.4        Thin Film Lithium Niobate      70
    • 3.4.1    Lithium Niobate on Insulator (LNOI)               71
      • 3.4.1.1 Overview of LNOI Technology              71
      • 3.4.1.2 Characteristics and Properties of LNOI        72
      • 3.4.1.3 LNOI Fabrication Processes 72
      • 3.4.1.4 LNOI-based Modulator and Switch Technologies  72
      • 3.4.1.5 Trends Toward Higher Speed and Improved Power Efficiency        73
      • 3.4.1.6 High-Speed LNOI Modulators             73
        • 3.4.1.6.1           Energy-Efficient LNOI Devices            74
        • 3.4.1.6.2           Emerging LNOI Device Technologies              74
  • 3.5        Indium Phosphide      74
    • 3.5.1    Indium Phosphide (InP) Integration 74
      • 3.5.1.1 InP as a Direct Bandgap Semiconductor     75
      • 3.5.1.2 InP-based Active Components          75
      • 3.5.1.3 Hybrid Integration of InP with Silicon Photonics     76
    • 3.5.2    InP PIC Players              76
  • 3.6        Barium Titanite and Rare Earth metals         76
    • 3.6.1    Barium Titanate (BTO) Modulators   77
  • 3.7        Organic Polymer on Silicon  78
    • 3.7.1    Polymer-based Modulators  79
  • 3.8        Wafer Processing        79
    • 3.8.1    Wafer Sizes by Platform          79
    • 3.8.2    Processing Challenges            80
    • 3.8.3    Yield Management     80
  • 3.9        Hybrid and Heterogeneous Integration         81
    • 3.9.1    Monolithic Integration              81
    • 3.9.2    Hybrid Integration       81
    • 3.9.3    Heterogeneous Integration   82
    • 3.9.4    III-V-on-Silicon              82
    • 3.9.5    Bonding and Die-Attachment Techniques  82
    • 3.9.6    Monolithic versus Hybrid Integration             83

 

4             ADVANCED PACKAGING TECHNOLOGIES 84

  • 4.1        Evolution of Packaging Technologies             84
    • 4.1.1    Traditional Packaging Approaches  87
    • 4.1.2    Advanced Packaging Roadmap        87
    • 4.1.3    Key Performance Metrics       89
  • 4.2        2.5D Integration Technologies            90
    • 4.2.1    Silicon Interposer Technology             91
    • 4.2.2    Glass Interposer Solutions   92
    • 4.2.3    Organic Substrate Options   92
  • 4.3        3D Integration Approaches   93
    • 4.3.1    Through-Silicon Via (TSV)       93
      • 4.3.1.1 TSV Manufacturing Process 94
      • 4.3.1.2 TSV Challenges and Solutions            95
    • 4.3.2    Hybrid Bonding Technologies              96
      • 4.3.2.1 Cu-Cu Bonding            98
      • 4.3.2.2 Direct Bonding              98
  • 4.4        Co-Packaged Optics (CPO)  98
    • 4.4.1    CPO Architecture Overview 98
    • 4.4.2    Benefits and Challenges        99
    • 4.4.3    Integration Approaches          100
      • 4.4.3.1 2D Integration                101
      • 4.4.3.2 2.5D Integration           101
      • 4.4.3.3 3D Integration                101
    • 4.4.4    Thermal Management             102
    • 4.4.5    Optical Coupling Solutions  102
  • 4.5        Optical Alignment       103
    • 4.5.1    Active vs Passive Alignment 103
    • 4.5.2    Coupling Efficiency    104
  • 4.6        Manufacturing Challenges   104

 

5             MARKETS AND APPLICATIONS           106

  • 5.1        Datacom Applications             106
    • 5.1.1    Data Center Architecture Evolution 108
    • 5.1.2    Transceivers   109
      • 5.1.2.1 Integration       110
    • 5.1.3    Artificial intelligence (AI) and machine learning (ML)          111
    • 5.1.4    Pluggable optics          111
    • 5.1.5    Linear drive and linear pluggable optics (LPO)        113
    • 5.1.6    Interconnects                115
      • 5.1.6.1 PIC-based on-device interconnects               115
      • 5.1.6.2 Advanced Packaging and Co-Packaged Optics       118
        • 5.1.6.2.1           Glass materials            119
        • 5.1.6.2.2           Co-Packaged Optics 120
      • 5.1.6.3 Photonic Engines and Accelerators 126
        • 5.1.6.3.1           Photonic processing for AI     127
        • 5.1.6.3.2           Convergence with software  127
        • 5.1.6.3.3           Photonic field-programmable gate arrays (FPGAs)               128
      • 5.1.6.4 Photonic Integrated Circuits for Quantum Computing       129
        • 5.1.6.4.1           Photonic qubits            129
    • 5.1.7    Optical Transceivers 132
      • 5.1.7.1 Architecture and Operation  133
      • 5.1.7.2 Market Players               133
      • 5.1.7.3 Technology Roadmap              134
    • 5.1.8    Co-Packaged Optics for Switches   134
      • 5.1.8.1 CPO vs Pluggable Solutions 134
      • 5.1.8.2 Power and Performance Benefits     135
      • 5.1.8.3 Implementation Challenges 135
    • 5.1.9    Data Center Networks             136
    • 5.1.10 High-Performance Computing           136
      • 5.1.10.1            On-Device Interconnects       137
      • 5.1.10.2            Chip-to-Chip Communication           137
      • 5.1.10.3            System Architecture Impact 137
    • 5.1.11 Chip-to-Chip and Board-to-Board Interconnects  138
    • 5.1.12 Ethernet Networking 138
  • 5.2        Telecommunications                139
    • 5.2.1    5G/6G Infrastructure 140
    • 5.2.2    Bandwidth Requirements      140
    • 5.2.3    Long-Haul and Metro Networks         141
    • 5.2.4    5G and Fiber-to-the-X (FTTx) Applications  141
    • 5.2.5    Optical Transceivers and Transponders       142
  • 5.3        Sensing Applications                143
    • 5.3.1    Lidar and Automotive Sensing            143
      • 5.3.1.1 Photonic Integrated Circuit-based LiDAR    144
    • 5.3.2    Chemical and Biological Sensing     147
    • 5.3.3    Optical Coherence Tomography       149
  • 5.4        Artificial Intelligence and Machine Learning             149
    • 5.4.1    AI Data Traffic Requirements               150
    • 5.4.2    Silicon Photonics for AI Accelerators              150
    • 5.4.3    Neural Network Applications              151
    • 5.4.4    Future AI Architecture Requirements             152
  • 5.5        Emerging Applications             152
    • 5.5.1    Quantum Computing and Communication               152
      • 5.5.1.1 Quantum Photonic Requirements   152
      • 5.5.1.2 Integration Challenges            153
      • 5.5.1.3 Market Players and Development     153
  • 5.5.2    Neuromorphic Computing   154
  • 5.5.3    Biophotonics and Medical Diagnostics        154

 

6             GLOBAL MARKET SIZE              156

  • 6.1        Global Silicon Photonics Market Overview 156
    • 6.1.1    Market Size and Growth Trends         156
    • 6.1.2    Market Segmentation by Application             157
  • 6.2        Datacom Applications             159
    • 6.2.1    Market Forecast 2023-2035 159
    • 6.2.2    Key Drivers and Restraints    160
  • 6.3        Telecom Applications               160
    • 6.3.1    Market Forecast 2023-2035 160
    • 6.3.2    Key Drivers and Restraints    162
  • 6.4        Sensing Applications                162
    • 6.4.1    Market Forecast 2023-2035 162
    • 6.4.2    Key Drivers and Restraints    163

 

7             SUPPLY CHAIN ANALYSIS      166

  • 7.1        Foundries and Wafer Suppliers          166
    • 7.1.1    CMOS Foundries         166
    • 7.1.2    Specialty Photonics Foundries           167
  • 7.2        Integrated Device Manufacturers (IDMs)     168
    • 7.2.1    Fabless Companies  168
    • 7.2.2    Fully Integrated Photonics Companies         169
  • 7.3        Foundries and Wafer Suppliers          169
  • 7.4        Packaging and Testing              170
    • 7.4.1    Chip-Scale Packaging             170
    • 7.4.2    Module-Level Packaging        170
    • 7.4.3    Testing and Characterization               171
  • 7.5        System Integrators and End-Users  171

 

8             TECHNOLOGY TRENDS          173

  • 8.1        Laser Integration Techniques              173
    • 8.1.1    Direct Epitaxial Growth           173
    • 8.1.2    Flip-Chip Bonding      174
    • 8.1.3    Hybrid Integration       174
    • 8.1.4    Advances and Challenges     174
  • 8.2        Modulator Technologies         175
    • 8.2.1    Silicon Modulators     176
    • 8.2.2    Germanium Modulators         176
    • 8.2.3    Lithium Niobate Modulators                176
    • 8.2.4    Polymer Modulators  176
  • 8.3        Photodetector Technologies                177
    • 8.3.1    Silicon Photodetectors            177
    • 8.3.2    Germanium Photodetectors                177
    • 8.3.3    III-V Photodetectors   178
  • 8.4        Waveguide and Coupling Innovations           178
    • 8.4.1    Silicon Waveguides    178
    • 8.4.2    Silicon Nitride Waveguides   178
    • 8.4.3    Coupling Techniques                179
  • 8.5        Packaging and Integration Advancements  179
    • 8.5.1    Chip-Scale Packaging             179
    • 8.5.2    Wafer-Scale Integration          180
    • 8.5.3    3D Integration and Interposer Technologies              180

 

9             CHALLENGES AND FUTURE TRENDS            182

  • 9.1        CMOS-Foundry-Compatible Devices and Integration         182
    • 9.1.1    Scaling and Miniaturization  183
    • 9.1.2    Process Complexity and Yield Improvement             183
  • 9.2        Power Consumption and Thermal Management    184
    • 9.2.1    Energy-Efficient Photonic Devices   185
    • 9.2.2    Thermal Optimization Techniques   186
  • 9.3        Packaging and Testing              186
    • 9.3.1    Advanced Packaging Solutions         186
    • 9.3.2    Automated Testing and Characterization    187
  • 9.4        Scalability and Cost-Effectiveness  188
    • 9.4.1    Wafer-Scale Integration          188
    • 9.4.2    Outsourced Semiconductor Assembly and Test (OSAT)   189
  • 9.5        Emerging Materials and Hybrid Integration 190
    • 9.5.1    Novel Semiconductor Materials        190
    • 9.5.2    Heterogeneous Integration Approaches      191

 

10          COMPANY PROFILES                193 (181 company profiles)

 

11          APPENDICES  311

  • 11.1     Glossary of Terms       311
  • 11.2     List of Abbreviations  312
  • 11.3     Research Methodology           314

 

12          REFERENCES 315

 

List of Tables

  • Table 1. Silicon Photonics vs. Electronics: Key Metrics Comparison.      21
  • Table 2. Photonic Technologies Comparative Analysis.     26
  • Table 3. Comparison between electronic and photonic computing.        30
  • Table 4. Electronics companies silicon photonics commercial activities.            31
  • Table 5. Manufacturing Metrics & Challenges.        32
  • Table 6. Manufacturing Targets vs Current State.   33
  • Table 7. Comparative cost analysis.               36
  • Table 8. Silicon Photonics Integration Schemes.    36
  • Table 9. Benefits of PICs.       37
  • Table 10. Photodetector Performance.         38
  • Table 11. III-V Device Performance. 39
  • Table 12. Optical Modulator Performance Comparison.  40
  • Table 13. Silicon Photonic Waveguide Characteristics.     41
  • Table 14. Optical Component Integration Metrics.               41
  • Table 15. Advantages of Silicon Photonics.               42
  • Table 16. Applications of Silicon Photonics.             43
  • Table 17. Comparison with Other Photonic Integration Technologies.     43
  • Table 18. Silicon Photonics vs Traditional Electronics: Performance Metrics.    45
  • Table 19. Switch IC Bandwidth and CPO Technology Evolution.  47
  • Table 20. Challenges in data center architectures.               47
  • Table 21. Key Trends of Optical Transceivers in High-End Data Centers.                47
  • Table 22. Core Components Specifications and Requirements   48
  • Table 23. Types of Emission and Photon Sources/Lasers.                49
  • Table 24. III-V Integration Challenges.           50
  • Table 25. Laser Integration Approaches Comparison.       50
  • Table 26. Modulator Types and Configurations.      51
  • Table 27. Waveguide Specifications and Requirements.  52
  • Table 28. Data Transmission Parameters and Specifications.       53
  • Table 29. Circuit Architecture Building Blocks.       54
  • Table 30. Integration Approaches.   55
  • Table 31. Silicon Photonics Component Specifications.   56
  • Table 32. Optical Properties of Silicon.         56
  • Table 33. Fabrication Processes for Silicon Photonics.     57
  • Table 34. Silicon Foundry Technology Comparison.            59
  • Table 35. Silicon-on-insulator (SOI) Platform Benchmarking.       60
  • Table 36. SOI Performance Benchmarks.   61
  • Table 37. Key SOI Players.      61
  • Table 38. Germanium Integration Methods and Applications.      62
  • Table 39. SiN Key Foundries.               64
  • Table 40. SiN Modulator Technologies.         66
  • Table 41. Silicon (SOI and SiN) Device Heterogeneous Integration.           66
  • Table 42. SiN Benchmarking.              68
  • Table 43. Applications of SiN in Photonics.               69
  • Table 44. SiN PIC Players.      69
  • Table 45. Benchmarking of TFLN.     71
  • Table 46. Characteristics and Properties of LNOI. 72
  • Table 47. LNOI Fabrication Processes.         72
  • Table 48. LNOI-based Modulator and Switch Technologies.           73
  • Table 49. Emerging LNOI Device Technologies.       74
  • Table 50. InP Benchmarking.               75
  • Table 51. Integration Technologies. 76
  • Table 52. InP PIC Players.       76
  • Table 53. BTO Benchmarking.             77
  • Table 54. Comparative analysis of materials.           77
  • Table 55. Benchmarking of Polymer on Insulator.  79
  • Table 56. Wafer Size Comparison by Platform.        79
  • Table 57. Wafer Processing Challenges.      80
  • Table 58. Yield Analysis by Process Step.    80
  • Table 59. Integration Scheme Comparison.              81
  • Table 60. Bonding and Die-Attachment Techniques.           82
  • Table 61. Monolithic versus Hybrid Integration.      83
  • Table 62. Packaging Technology Comparison Matrix.          84
  • Table 63. Evolution of semiconductor packaging. 84
  • Table 64. Summary of key advanced semiconductor packaging approaches.   88
  • Table 65. Key Performance Metrics for Advanced Packaging Technologies.         89
  • Table 66. Glass Interposer Solutions.            92
  • Table 67. Organic Substrate Options.            93
  • Table 68. TSV Specifications by Application.            94
  • Table 69. TSV Challenges and Solutions.    95
  • Table 70. Comparative benchmark overview table of key semiconductor interconnection technologies                97
  • Table 71. CPO Benefits and Challenges.     99
  • Table 72. Performance Metrics Comparison.           100
  • Table 73. CPO Integration Approaches Comparison.         100
  • Table 74. Manufacturing Process Comparison.      102
  • Table 75. Thermal Management Approaches.         102
  • Table 76. Optical Coupling Solutions.           103
  • Table 77. Alignment Tolerance Analysis.     103
  • Table 78. Active vs Passive Alignment Comparison.            103
  • Table 79. Coupling Efficiency Analysis.        104
  • Table 80. Advanced packaging manufacturing challenges.            104
  • Table 81. Energy Consumption Analysis.    107
  • Table 82. Key Metrics for Advanced Semiconductor Packaging Performance.   119
  • Table 83. Pluggable Optics vs. Co-Packaged Optics (CPO).           122
  • Table 84. Future Challenges in Co-Packaged Optics (CPO).          123
  • Table 85. Key Technology Building Blocks for Co-Packaged Optics.          124
  • Table 86. Key Packaging Components for Co-Packaged Optics. 124
  • Table 87. Key Players in Photonic Quantum Computing.  129
  • Table 88. Comparison of PICs vs Traditional Optical Systems.     130
  • Table 89. Future PIC Requirements of the Quantum Industry.      131
  • Table 90. Optical Transceivers Market Players.        133
  • Table 91. Power and Performance Benefits.              135
  • Table 92. Implementation Challenges.         135
  • Table 93. Silicon Photonics in HPC: Technical Parameters              136
  • Table 94. Applications of Silicon Photonics in Telecommunications.       139
  • Table 95. Bandwidth Requirements by Segment.   141
  • Table 96. 5G and FTTx Applications Technical Parameters.            142
  • Table 97. Opportunities for PIC Sensors in LiDAR Applications.  144
  • Table 98. Challenges of PIC-based FMCW LiDARs.              145
  • Table 99. Companies Developing PIC-based LiDAR.           145
  • Table 100. Companies Developing PIC Biosensors.            147
  • Table 101. Companies Developing PIC-based Gas Sensors.         147
  • Table 102. Companies Developing Spectroscopy PICs.    148
  • Table 103. AI Data Traffic Requirements.     150
  • Table 104. Neural Network Applications.    151
  • Table 105. Future AI Architecture Requirements.  152
  • Table 106. Quantum Photonic Requirements.         153
  • Table 107. Integration Challenges in Quantum Computing and Communication.           153
  • Table 108. Market players and development.           153
  • Table 109. Biophotonics Applications.         155
  • Table 110. Global Market for Silicon Photonics 2023-2035 (Billions USD).           156
  • Table 111. Market Segmentation by Application 2023-2035 (Billions USD).        158
  • Table 112. Market Forecast for Silicon Photonics in Datacom Applications 2023-2035 (Billions USD).                159
  • Table 113. Key market drivers and restraints for silicon photonics in Datacom Applications.  160
  • Table 114.  Market Forecast for Silicon Photonics in Telecom Applications 2023-2035 (Billions USD)                160
  • Table 115. Key market drivers and restraints for silicon photonics in Telecom Applications.    162
  • Table 116. Market Forecast for Silicon Photonics in Sensing Applications 2023-2035 (Billions USD). 162
  • Table 117. Key market drivers and restraints for silicon photonics in Sensing Applications.     164
  • Table 118. CMOS Foundries.               166
  • Table 119. Specialty Photonics Foundries. 167
  • Table 120. Fabless Companies.        168
  • Table 121. Fully Integrated Photonics Companies.              169
  • Table 122. Foundries and Wafer Suppliers.                170
  • Table 123. System Integrators and End-Users.        172
  • Table 124. Laser Integration Methods Comparison.            173
  • Table 125. Advanced Techniques and Challenges.               174
  • Table 126. Modulator Technology Benchmarking. 175
  • Table 127. Photodetector Performance Metrics .   177
  • Table 128. Novel semiconductor materials for silicon photonics.              190
  • Table 129. Glossary of terms.              311
  • Table 130. List of abbreviations.        312

 

List of Figures

  • Figure 1. Silicon Photonic Transceiver Evolution Timeline.              22
  • Figure 2. Silicon Photonics Player Market Map.       25
  • Figure 3. Basic Silicon Photonic Circuit Architecture.         35
  • Figure 4. High Performance AI data center. 46
  • Figure 5. Optical IO Coupling Mechanisms Diagram.         49
  • Figure 6. Optical Component Density Evolution.   53
  • Figure 7. Basic Optical Data Transmission Diagram.          54
  • Figure 8. SOI Wafer Structure.             58
  • Figure 9. Manufacturing Process Flow.         59
  • Figure 10. Germanium Photodetector.          63
  • Figure 11. Silicon Nitride Layer Stack.           64
  • Figure 12. AEPONYX SiN PICs.           65
  • Figure 13. SiN Waveguide Cross-sections. 68
  • Figure 14. LNOI Device Structures . 71
  • Figure 15. Timeline of different packaging technologies.  86
  • Figure 16. Advanced Packaging Roadmap. 88
  • Figure 17. 2D chip packaging.            90
  • Figure 18. Typical structure of 2.5D IC package utilizing interposer.          92
  • Figure 19. TSV Structure and Implementation.        95
  • Figure 20. Hybrid Bonding Process Flow.     98
  • Figure 21. Co-Packaged Optics Architecture.           99
  • Figure 22. Optical module with pluggable fibre interconnect.       112
  • Figure 23. Roadmap for PIC-Based Transceivers.  114
  • Figure 24. Evolution Roadmap for Semiconductor Packaging.     118
  • Figure 25. Roadmap for photonic quantum hardware.       132
  • Figure 26. Optical Transceivers Technology Roadmap.      134
  • Figure 27. 5G/6G Implementation Roadmap.          140
  • Figure 28. LiDAR System Design.      144
  • Figure 29. Global Market for Silicon Photonics 2023-2035 (Billions USD).            157
  • Figure 30. Market Segmentation by Application 2023-2035 (Billions USD).         158
  • Figure 31. Market Forecast for Silicon Photonics in Datacom Applications 2023-2035 (Billions USD).                159
  • Figure 32. Market Forecast for Silicon Photonics in Telecom Applications 2023-2035 (Billions USD).                161
  • Figure 33. Market Forecast for Silicon Photonics in Sensing Applications 2023-2035 (Billions USD). 163
  • Figure 34. Silicon Photonics Supply Chain and Ecosystem.           166
  • Figure 35. Concept for advanced packaging for integrated photonics.    180
  • Figure 36. Aeries II LiDAR system.    194
  • Figure 37. PsiQuantum’s modularized quantum computing system networks. 267
  • Figure 38. Q.ANT Native Processing Unit (NPU).     269
  • Figure 39. QuiX low-loss photonic quantum processors. 274

 

 

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